Prior to joining CU Denver, Dr. Feng Lin was a research scientist at SUNY Buffalo. He received his Ph.D. degree in Electrical and Computer Engineering from Tennessee Technological University in 2015 and his B.S. degree from Zhejiang University in 2006. He worked for Alcatel-Lucent (now Nokia) from 2009 to 2010.
Dr. Lin won the Best Paper Award in IEEE BHI’17 conference, Best Demo Award in ACM HotMobile’18 conference, and First Prize Design Award in 2016 International 3D printing competition. His work has been reported by more than 100 public media, including National Public Radio, the Wall Street Journal, National Science Foundation’s News, and Communication of ACM’ news, etc. His research interests lie in areas of mobile sensing, healthcare IoT, and cyber-physical security.